
Key Features
ndustrial-
rade
ilinx S
artan-3E FPGA module
1200 k
ates or 1600 k
ates)
B 2.0
Hi-S
eed USB
interface with a si
nalin
bit rate of
to 480 Mb/s
6-bit wide 512 Mbit DDR
DRAM
PGA confi
uration throu
h:
t
2B
nn
t
r
t
TAG
ort
t
PI Flash memor
ar
e
PI Flash
emory (for confi
uration and operation)
ccessible throu
h:
t
2B connector
SPI direct
t
P
A
t
TAG
ort
SPI indirect
t
PI
ort
SPI direct
t
SB bus (Firmware Up
rade Tool)
n-board 100 MHz oscillator for hi
h performance
n-board 24 MHz oscillator available to user
on-board hi
h-power, hi
h-efficiency, switch-mode DC-DC
onverters ca
able of 1 A each
ower supply ran
e: 4.0 - 5.5 V
ower suppl
via USB or B2B (carrier board)
to 110 FPGA I/O
ins available on B2B connectors
LED, 1
ush buttons.
Development Suite
A hardware development plat
orm is available. Latest
documentation, design support
les and so
tware developmen
suite are available
or download
ree o
charge
user manua
, app
cat
on note
schematics, assembly diagrams,
AD library file
U
B 2.0 and DDR2
DRAM data communication API
device drivers,
rmware
IP-cores
DMA, EZ-U
B, I2
programming tools
PI Flash
re
erence bit-stream
re
erence design
reference Xilinx MicroBlaze system
EDK
Assembly Options
art number
ates [M] block-RAM [kbit] clock [MHz] DDR RAM [Mbit] temp. ran
e
TE
-
1
1.
4
2
1
TE
-
1B
1.
4
2
1
TE
-
1BML
1.
4
1
TE
-
1N
1.
4
2
mm
TE
-
1
4
1
n
.
0300-01
1.
4
51
n
.
0300-01
1.
4
51
n
.
ustom assembly options for cost or performance optimization are available upon request.
n
neere
or
ree
nx WebPACK em
e
e
processo
U
B controller b
U
B 2.0 b
www.trenz-electronic.de
te030
11
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